Assembly Location Change Plus Mold Compound and Silver Epoxy Change for Platform Flash VOG20 Packages (XCN16001) - To communicate two changes to the 1-Mbit, 2-Mbit, and 4-Mbit Platform Flash devices of the Xilinx In-System Programmable Configuration PROMs. - XCN16001
xcn16001.pdf
- Document ID
- XCN16001
- Release Date
- 2016-06-20
- Revision
- 1.0.1 English