Flash Wafer Fabrication Change and Gold (Au) To Copper (Cu) Transition For Spartan-3AN FPGA Devices(XCN14003) - To communicate a change in wafer fabrication facility location and process technology shrink change in-system flash memory used in the Spartan -3AN FPGA devices. In addition, Xilinx is transitioning the wire bond packages from gold (Au) to copper (Cu) wires. - XCN14003
xcn14003.pdf
- Document ID
- XCN14003
- Release Date
- 2014-10-27
- Revision
- 1.3 English