Substrate Ball Pad Metallization Change for Defense-Grade Virtex-6Q FPGA Flip Chip RF Packages (XCN13011) - The purpose of this notification is to communicate that Xilinx will convert the substrate ball pad metallization from Nickel/Gold plating to Eutectic Cu Solder on Pad (SOP) for Defense-Grade Virtex -6Q FPGA flip chip RF packages. There is no change to the fit, form, or function.