Pin Gate Mold Implementation For FG (G) and BG (G) Wire Bond Packages (XCN12023) - To communicate that Xilinx is transitioning to pin gate mold (PGM) in plastic ball grid array FG(G) and BG(G) packages. - XCN12023
xcn12023.pdf
- Document ID
- XCN12023
- Release Date
- 2013-01-24
- Revision
- 1.0.1 English