Pin Gate Mold Implementation For TQ (G)100, TQ (G)144 and VQ (G)100 Wire Bond Packages (XCN12022) - To communicate that Xilinx is transitioning to Pin gate mold (PGM) in TQG and VQG packages. - XCN12022
xcn12022.pdf
- Document ID
- XCN12022
- Release Date
- 2012-12-16
- Revision
- 1.0 English