Substrate Ball Pad Metallization Change for Virtex-6 FPGA Flip Chip Packages (XCN12015) - This notification is to communicate that Xilinx has qualified an additional substrate ball pad metallization called CuSOP for Virtex -6 FPGA flip chip packages. - XCN12015

Document ID

XCN12015

Release Date

2012-07-16

Revision

1.0 English