Spartan, Virtex and CoolRunner Series Wire Bond BGA Packaging Material Source Addition (XCN11018) - To communicate the addition of new supply sources for wire bond BGA package core and prepreg material for Spartan /-XL/-II/-IIE/-3/-3E/-3A/-3AN/-3ADSP/-6, XC95XXX, XC95XXXXL, Virtex , Virtex -E, Virtex -II/-ll Pro, and CoolRunner and CoolRunner -II product. - XCN11018
xcn11018.pdf
- Document ID
- XCN11018
- Release Date
- 2011-07-25
- Revision
- 2.0 English