Virtex-5 FPGA Flip Chip BGA Packaging Material Source Additions (XCN11017) - To communicate an addition of a new supply source for Virtex -5 FPGA flip chip BGA package core material and also announce an additional package supplier for Virtex-5 FPGA flip chip BGA package substrates. - XCN11017

Document ID

XCN11017

Release Date

2011-10-07

Revision

1.1 English