Virtex-4 and Virtex-5 FPGA Flip Chip BGA Package Material BT-to-ABF Conversion (XCN11004) - To communicate an addition of a new supply source for Virtex -4 and Virtex -5 FPGA flip chip package build up layers - XCN11004
xcn11004.pdf
- Document ID
- XCN11004
- Release Date
- 2011-05-02
- Revision
- 1.1 English