Flip Chip Substrates BT to ABF Conversion for Two Aerospace Defense ‘XQ’ Virtex-II Pro FPGA Devices (XCN10014) - To announce the conversion of substrate material from BT to ABF build-up for two Aerospace and Defense ‘XQ” Virtex-II Pro FPGA device/packages. - XCN10014
xcn10014.pdf
- Document ID
- XCN10014
- Release Date
- 2010-04-19
- Revision
- 1.0 English