Assembly Location and Mold Compound Change for Platform Flash TSOP48 Packages (XCN07015) - This notice describes two changes to the 8-Mbit, 16-Mbit, and 32-Mbit Platform Flash devices of the Xilinx In-System Programmable Configuration PROMs manufactured by ST Microelectronics; the assembly and finish plant location change for all TSOP48 packages, and the consolidation of mold compound material to ensure use of the same mold compound across all TSOP48 packages.