Mold Compound and Die Attach Epoxy Material Conversion For Military Products (XCN05019) - The mold compound and die-attach materials are moving to the same material set as used in our ROHS-compliant product. The ROHS-compliant material set is halogen-free, meets moisture sensitivity level (MSL) 3 per JEDEC standard J-STD-020C, and meets UL94 V-0 flammability requirements. The change in assembly materials does not affect the fit or function of the devices.