Change in Wafer Fabrication Facility for XC95144XL and XC9572XL CPLDs (XCN05003) - The XC95144XL and XC9572XL CPLD devices will transition from a 0.35mm four-layer metal Flash CMOS process at UMC, Taiwan to a 0.35mm four-layer metal Flash CMOS process at He Jian Technology Company, China. - XCN05003
xcn05003.pdf
- Document ID
- XCN05003
- Release Date
- 2005-01-30
- Revision
- 1.0 English