Four- and Six-Layer High-Speed PCB Design for the Spartan-3E FT256 BGA Package Application Note (XAPP489) - Xilinx XAPP489 Four- and Six-Layer High-Speed PCB Design for the Spartan-3E FT256 BGA Package application note - XAPP489
xapp489.pdf
- Document ID
- XAPP489
- Release Date
- 2006-10-30
- Revision
- 1.0 English