Mechanical and Thermal Design Guidelines for Lidless Flip-Chip Packages Application Note (XAPP1301) - Describes specifications, guidelines, and best practices for using Lidless Flip-Chip Packages. - XAPP1301
xapp1301-mechanical-thermal-design-guidelines.pdf
- Document ID
- XAPP1301
- Release Date
- 2021-02-23
- Revision
- 1.6 English