CoolRunner-II Chip Scale Package Details (WP165) - The two CSP discussed in this white paper are the CP56 and CP132 packages. Due to their small ball spacing and associated layout issues, there are certain topics such as solder mask openings and escape routing concerns which are discussed in this white paper. - WP165
wp165.pdf
- Document ID
- WP165
- Release Date
- 2002-09-24
- Revision
- 1.0 English