Alternative T-Glass Cloth Substrate Material for FPGA and SoC Packages (XCN25005) - Advanced Micro Devices, Inc., is adopting alternative T-glass cloth materials by different suppliers for the package substrate due to a supply shortage. - XCN25005
XCN25005.pdf
- Document ID
- XCN25005
- Release Date
- 2025-12-22
- Revision
- 1.0 English