Lead-Free Bump Conversion for Virtex 7, XQ Kintex UltraScale, Virtex UltraScale, and XC and XQ Virtex UltraScale+ FPGAs (XCN23007) - The purpose of this notification is to announce Advanced Micro Devices, Inc. will begin the transition to lead-free C4 bump and lead-free substrates for the Commercial “XC” and Defense-grade “XQ” devices in Virtex™ 7, Kintex™ UltraScale™, Virtex UltraScale, and Virtex UltraScale+™ families. - XCN23007
XCN23007.pdf
- Document ID
- XCN23007
- Release Date
- 2024-04-29
- Revision
- 1.1 English