Product Change Notice For Lead-Free Bump Conversion for Virtex-4/-5/-6 and Series 7 FPGAs Defense (XQ) and Space (XQR) Flip-Chip Products (XCN21013) - Announces that AMD-Xilinx is converting the bump to lead-free for Virtex-4/-5/-6 and Series 7 FPGAs Defense (XQ) and Space (XQR) flip-chip products. - XCN21013
XCN21013.pdf
- Document ID
- XCN21013
- Release Date
- 2022-09-12
- Revision
- 1.0 English