Cross-Ship of Lead-Free Bump in Lead-Free Substrates for Virtex-4 FPGAs (FFG/SFG Packages)(XCN20006) - The purpose of this notification is to announce Xilinx® will begin the transition to lead-free materials of the devices in the Virtex®-4 FPGAs product family as a continuation of XCN19005. Defense-grade “XQ” and Automotive “XA” device-packages are not affected by this PCN.