Cross-Ship of Lead-Free Bump in Lead-Free Substrates for Large Die (FFG/FBG/SBG Packages)(XCN19005) - The purpose of this notification is to announce Xilinx® will begin the transition to lead-free materials of the larger devices in the Virtex®-5, Virtex®-6, Artix®-7, Kintex®-7, Virtex®-7 FPGAs and Zynq®-7000 product families as a continuation of XCN16022. Defense-grade “XQ” and Automotive “XA” device-packages are not affected by this PCN.