Lead-Frame Plating Composition Change For Legacy Eutectic Products (XCN18024) - The purpose of this notification is to announce the transition into Pre-Plated Lead-Frame (PPF) manufacturing for Spartan -II and Spartan -3 FPGAs, CoolRunner-II CPLD and QPro PROM wire-bond package eutectic products. There is no change to the fit, form, function or Moisture Sensitivity Level (MSL) rating of the packages.