Flip-Chip Bumping Factory Site Additional Qualification for Defense Grade XQ Product (XCN18018) - The purpose of this notification is to communicate that Xilinx will continue supplying Eutectic bump from an additional bump factory at Siliconware Precision Industry Ltd. (SPIL) for the next few coming years for all Virtex -II Pro, Virtex -4, Virtex -5 and Virtex -6 FPGAs defense-grade “XQ” flip-chip products. As described in XCN16003, Xilinx has also qualified defense-grade 7 Series XQ FPGA product on the additional bump facility. - XCN18018

XCN18018.pdf

Document ID
XCN18018
Release Date
2018-07-16
Revision
1.0 English