These documents provide supplemental material useful with this application note:
- Yohan Frans, IEEE Education Session, Overview of ADC-based Wireline Transceiver, CICC 2019
- Geoff Zhang, et al, A Tutorial on PAM4 Signaling for 56G Serial Link Applications, DesignCon 2017
- OIF Common Electrical I/O (CEI) - Electrical and Jitter Interoperability agreements: OIF- CEI-04.0
- IEEE standards for Ethernet: IEEE Std 802.3bs-2017, IEEE Std 8023cd-2018, and IEEE Std 802.3ck-2022
- Versal Adaptive SoC GTM Transceivers Architecture Manual (AM017)
- Versal Prime Series Data Sheet: DC and AC Switching Characteristics (DS956)
- Versal Premium Series Data Sheet: DC and AC Switching Characteristics (DS959)
- Versal HBM Series Data Sheet: DC and AC Switching Characteristics (DS960)
- Eben Kunz, et al, Sources and Compensation of Skew in Single-Ended and Differential Interconnects, DesignCon 2014
- Eric Bogatin, et al, New Characterization Technique for Glass-Weave Skew, DesignCon 2016/2017
- Scott McMorrow, et al, The Impact of PCB Laminate Weave on the Electrical Performance of Differential Signaling at Multi-Gigabit Data Rates, DesignCon, 2005
- Jeff Loyer, et al, Fiber Weave Effect: Practical impact Analysis and Mitigation Strategies, DesignCon 2007
- Versal Adaptive SoC Packaging and Pinouts Architecture Manual (AM013)