x86 TDP, Thermal Models, Package Files, and Pressure Specifications

For the embedded x86 products, a different approach is required because x86 devices have more deterministic power envelop than the FPGA and adaptive SoC devices.

Documentation for x86 products is available through the technical information portal (TIP) tool. Product data sheets specify the total design power (TDP) for each device based on the desired use case. Thermal model, package drawings, and pressure specifications are all available in their relevant documents. The following table provides a quick reference to the required documents to find this information.

Note: Access to the documents on the TIP is restricted to users with the appropriate permissions. If you do not have access, ensure that you have obtained the necessary permissions or contact your administrator for assistance.

Table 1. x86 Device and Documentation Overview
Name	Package	Platform Type	Variants Covered	Package Drawings		Thermal Model		Pressure Spec
Name	Package	Platform Type	Variants Covered	Doc Name	Doc Number	Doc Name	Doc Number	Location	Units	Static Maximum	Dynamic Maximum
V3000	FP7r2	Type 1/2	V3C18 V3C18I V3G18I V3C16 V3C14 V3C48 V3G48 V3C44	FP7r2 Processor Functional Data Sheet, Figure 9  Functional Data Sheet for FP7r2 Processors, Figure 9	56919e 56919	Flotherm Thermal Model User’s Guide for FP7 and FP7r2 Package Processors	56938	Surface¹  Edge²	lbf	40  10	100  10
Ryzen 8000	FP7r2	Type 3	Ryzen 7 Pro 8845HS  Ryzen 7 Pro 8840U  Ryzen 5 Pro 8645HS   Ryzen 5 Pro 8640U	Functional Data Sheet for FP7r2 Processors, Figure 10	56919	Flotherm Thermal Model User Guide for FP8, FP7, and FP7r2 “Phoenix/Hawk Point” Processors	57270	Surface¹  Edge²	lbf	40  10	100  10
V2000	FP6	Type 1	Ryzen Embedded V2748  Ryzen Embedded V2546  Ryzen Embedded V2718  Ryzen Embedded V2516	FP6 Infrastructure — 2D Drawing  Functional Data Sheet for FP6 Processors, Figure 9	65353  56177	Flotherm Thermal Model User Guide for FP6 Package Processors	56484	Surface¹  Edge²	lbf	40  10	100  10
R2000	FP5		R2544  R2514  R2314  R2312	FP5 Processor Functional Data Sheet, Figure 5	55594e	Flotherm Thermal Model User’s Guide for FP5 Package Processors	55596	Surface¹  Edge²	lbf	40  10	100  10
EPYC 3000	SP4r2			Thermal Design Guide for SP4r2 Processors, Figure 1	56204	Flotherm Thermal Model User's Guide for SP4r2 Processors	56167	Surface¹	lbf	22.5 +- 7.5	NA
EPYC	FL1	Type 2		Functional Data Sheet for FL1 Processors, Figure 3.3 & Figure 3.4	57417	Flotherm Thermal Model User Guide for FL1 Processors	57421	Surface¹  Edge²	lbf	40  10	100  10
V4000	FP8	Type 5	V4526-X  V4324  V4546i-X  V4324i	Functional Data Sheet for FP8 Processors, Figure 3.5	57262	Flotherm Thermal Model and User Guide for AMD Family 1Ah Models 68h-6Fh Krackan2 FP8 Processors	58658	Surface  Edge²	lbf	40  10	100  10
V4000-H	FP8	Type 4	Ryzen 7 Pro	Functional Data Sheet for FP8 Processors, Figure 3.4	57262	Flotherm Thermal Model and User Guide for AMD Family 1Ah Models 60h-67h FP8 Processors	58162	Surface¹  Edge²	lbf	40  10	100  10
PROM21			B650	PROM21 Sub-Family Datasheet for 600-Series Chipsets, Figure 8	57163e	AMD 600-Series Chipsets PROM21 Flotherm Model	64294	Surface¹	lbf	4.6
Load specified for coplanar contact to the die surface. Load defined for a surface at no more than a two-degree angle of inclination to the die surface.

x86 TDP, Thermal Models, Package Files, and Pressure Specifications - XAPP1377

Designing Thermal Solutions for AMD Embedded Devices (XAPP1377)