Every product is unique, creating many challenges in creating a one size fits all thermal solution. While there might be off the shelf solutions in the market that might be good enough, a properly designed thermal solution is going to be unique for each application. AMD provides the necessary mechanical dimensions and requirements and the means to estimate the power consumption of the device requiring thermal relief.
Beyond providing the mechanical and power consumption information, it is imperative that customers use this information or engage with thermal solution vendors to mate these requirements to their end product requirements necessary for proper operation and deployment. Engagement with thermal vendors should coincide with the creation of power estimates to allow time for prototyping thermal solutions, ideally allowing the prototypes to be in hand when first article boards arrive.
Below is a typical checklist of required information to develop a thermal solution. This list is not all encompassing but should be used as a guide when engaging in conversations with thermal vendors.
Elements provided by AMD:
- Package dimensions
- Length, width, height
- For lidless additional dimensions to all top side surfaces (stiffener ring, die, clearances, and more)
- Total power consumption
- Customer defined PDM or XPE power estimates made for real world worst-case operating environments
- Maximum junction temperature
- Mounting pressure restrictions
Elements defined by application:
- Maximum length, width, height
- Environmental restrictions (temperature range, automotive, space)
- Material restrictions
- Mounting restrictions
It is imperative that you engage with thermal vendors to tailor your solution to your specific application. Many thermal vendors have extensive design services and simulation capabilities to maximize the efficiency of the thermal solution. While not an exhaustive list, you can find a list of partner vendors here: http://www.amd.com/power.