As mentioned in TIM Selection, poor TIM coverage or the formation of voids can seriously compromise the thermal integrity of the system. The target coverage should exceed 95% to ensure proper heat conduction from the device without causing hot spots or other undesirable effects. Periodic verification of the TIM coverage after assembly is necessary to ensure that application methods adequately meet this target. Additional qualification testing after several thermal cycles is also recommended to help ensure the longevity of TIM performance.