Revision History - XAPP1377

Designing Thermal Solutions for AMD Embedded Devices (XAPP1377)

Document ID

XAPP1377

Release Date

2025-06-27

Revision

2.0 English

The following table shows the revision history for this document.

Section	Revision Summary
06/27/2025 Version 2.0
General Updates	Updated and added text throughout the document. Updated and added images throughout the document. Updated and added notes throughout the document. Updated and added tables throughout the document. Renamed title and sections throughout the document.
Embedded x86 BGA Packages Ryzen and EPYC Covers FPx, FLx, and SPx x86 TDP, Thermal Models, Package Files, and Pressure Specifications Getting Started with a Thermal Solution for an AMD FPGA or Adaptive SoC	Added new sections.
06/06/2022 Version 1.0
Initial release.	N/A