These documents provide supplemental material useful with this application note:
- Versal Adaptive SoC Packaging and Pinouts Architecture Manual (AM013)
- 7 Series FPGAs Packaging and Pinout Product Specification (UG475)
- UltraScale and UltraScale+ FPGAs Packaging and Pinouts Product Specification (UG575)
- Zynq 7000 SoC Packaging and Pinout Product Specifications (UG865)
- Zynq UltraScale+ Device Packaging and Pinouts Product Specification User Guide (UG1075)
- Kria K26 SOM Thermal Design Guide (UG1090)
- Extending the Thermal Solution by Utilizing Excursion Temperatures (WP517)
- Addressing Thermal Challenges with Innovative Packaging Solutions (WP563)
- Device Models
- PDM for SOM Download
- Power Design Manager PDM
- Power Efficiency
- Thermal Models Download
- XPE Download
- XPE for Thermal Analysis Video
- http://www.amd.com/power