The use of a pressure sensor or gauge placed between the thermal system and the device is a prudent method to measure and fine-tune both transient and steady-state pressure applied to the device. This is appropriate only during the early prototyping stages, but not during operation. This method adjusts and refines the assembly process to ensure transient pressure does not exceed the maximum 50 PSI exerted on the device. Furthermore, it ensures that the final steady-state pressure is even and within device pressure targets after the settling of the TIM and any pressure compensating features of the attachment.