Lidded Devices - XAPP1377

Designing Thermal Solutions for AMD Embedded Devices (XAPP1377)

Document ID: XAPP1377
Release Date: 2025-06-27
Revision: 2.0 English

Summary
Introduction
Steps to Designing a Thermal System
Choosing and Determining Package Lid Type
Lidded vs. Lidless Devices
Lidded Devices
Wire Bond Packages
Lidded Flip Chip
Stamped Flip Chip Lid
Forged Flip Chip Lid
Lidless Devices
Bare Die Lidless
Lidless with Stiffener Ring
Embedded x86 BGA Packages Ryzen and EPYC Covers FPx, FLx, and SPx
InFO
Kria SOM with Heat Spreader
Sizing and Designing the Heatsink
Early Evaluation of Device/Package Thermal Properties
Device, Lid Type, and Associated Documentation Identification
Determining Height and Contact Area for the Heatsink
Lidded
Bare Die
Lidless with Stiffener Ring
InFO
Kria SOM
Mechanical CAD Models and Samples
Coplanarity and Etching of the Contact Surface Area
Selecting a Heatsink Base
Size
One Piece Heatsink vs Individual Heat Spreaders
Sizing the Contact Surface
Material: Use of Two-Phase Components and Liquid Cooling
Airflow and Determining Heatsink Fins
TIM Selection
Considerations when Selecting a TIM
Types of TIM Material
TIM Quantity and Application
Heatsink Attachment and Mounting
Calculating Spring Constant for Attachment
Evaluate Board Bracing
Designing a Heatsink for Multiple Devices and Packages
Thermal Simulation FPGA and Adaptive SoC
When to Simulate
Obtaining Thermal and Power Targets to Use with Thermal Simulation
Supported Simulators and Simulation Models for AMD Devices
Obtaining AMD Thermal Models and Information
Guidance for Modeling the Etching Pattern for Simulation
Evaluating Simulation Results
x86 TDP, Thermal Models, Package Files, and Pressure Specifications
Assembly, Test, and Debug
Managing Transient Pressure
Measuring Heatsink Pressure
Board Strain Measurement
Testing TIM Coverage
Heatsink Removal Considerations
Creating a Thermal Test Design
Using SYSMON for Operational Junction Temperature Measurement
Power Measurement
Using Thermocouples for External Debug
Correlate to Simulation and Update Thermal Power Estimation Data
Getting Started with a Thermal Solution for an AMD FPGA or Adaptive SoC
Thermal Solution Design Getting Started Guide
Example Heatsink Design
Conclusion
References
Revision History
Please Read: Important Legal Notices

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