Kria SOM - Kria SOM - XAPP1377

Designing Thermal Solutions for AMD Embedded Devices (XAPP1377)

Document ID
XAPP1377
Release Date
2025-06-27
Revision
2.0 English

Because the Kria devices have a heat spreader, consult the appropriate thermal design guide to find the recommended contact area. Mounting is done directly to the M3 mounting holes, and thus there are no specific height tolerances to adhere to.

Figure 1. Recommended Contact Area for K26 SOM