Kria SOM with Heat Spreader - Kria SOM with Heat Spreader - XAPP1377

Designing Thermal Solutions for AMD Embedded Devices (XAPP1377)

Document ID
XAPP1377
Release Date
2025-06-27
Revision
2.0 English

The AMD Kria™ system on a module (SOM) is a product containing multiple devices on a miniature printed circuit board (PCB) centering on an AMD device surrounded by other active and passive components. The SOM greatly simplifies design by including memory, voltage regulation, and other chip-level design requirements into a single, pre-designed module. Because the SOM consists of multiple chips, there are multiple points of cooling needed on a SOM. AMD simplifies this by including a pre-assembled heat spreader to the SOM. This means that the only requirement is to attach a heatsink (if necessary) to the flat heat spreader to control the temperature of the SOM.

Figure 1. Kria SOM with Pre-Assembled Heat Spreader