AMD embedded x86 BGA packages are organic micro-BGA packages. These lidless packages offer enhanced thermal performance versus tradition lidded or integrated heat spreader (HIS) packages and allow direct access to the CPU/ APU die. These packages have a stiffener ring around the periphery of the package substrate to provide rigidity.
Note: The stiffener ring height can be higher than the die. In these
scenarios a pedestal or island is required. See the section and package diagram for the
device package combination being used.
Figure 1. Lidless with Stiffener Ring Package
