It is also suggested to characterize the maximum board flex or strain encountered during construction, assembly, testing, and use to ensure excessive board stress does not contribute to potential BLR issues. The measurement of this flex or strain is accomplished through the use of a strain gauge. AMD suggests keeping the stress on the board within ±500 μstrain. Additionally, dye and pry analysis can be employed alongside strain measurement to ensure proper device contact with the pads exists after final assembly and testing, providing further evidence of a reliable process.