Assembly, Test, and Debug - Assembly, Test, and Debug - XAPP1377

Designing Thermal Solutions for AMD Embedded Devices (XAPP1377)

Document ID
XAPP1377
Release Date
2025-06-27
Revision
2.0 English

This section provides some guidance to the mechanical assembly of the thermal solution as well as best practices for thermal testing, characterization, and debug of the AMD device in-system.