Conclusion - Conclusion - XAPP1377

Designing Heatsinks and Thermal Solutions for Xilinx Devices (XAPP1377)

Document_ID
XAPP1377
Release_Date
2022-06-06
Revision
1.0 English

As stated in the introduction, every thermal design is unique. This application note and the examples included are intended to point out some best practices, but they are not necessarily a precise procedure to how every thermal design should proceed. Following these guidelines can provide better thermal management for your products.