Assembly, Test, and Debug - Assembly, Test, and Debug - XAPP1377

Designing Heatsinks and Thermal Solutions for Xilinx Devices (XAPP1377)

Document_ID
XAPP1377
Release_Date
2022-06-06
Revision
1.0 English

This section provides some guidance to the mechanical assembly of the thermal solution as well as best practices for thermal testing, characterization, and debug of the Xilinx device in-system.