A Technique to Reduce Cross Talk Between Copper Routes Under a 1 mm Pitch BGA (WP547) - Discusses a technique to reduce cross talk between signal routes under a 1 mm pitch BGA, without losing significant PCB real estate for outer breakout routing. - WP547
- Document ID
- WP547
- Release Date
- 2022-09-23
- Revision
- 1.0 English