UltraScale+ Device SEL - UG584

Using LVAUX Mode in XQ Ruggedized UltraScale+ Devices for Airborne Systems Design Guide (UG584)

Document ID
UG584
Release Date
2024-05-03
Revision
1.1 English

The device-level SEL is not destructive for UltraScale+ devices when operating within the Earth’s atmosphere. The device continues to operate with any potential impact isolated to the function of the block where the SEL occurred. The SEL only impacts the operation of the SYSMON block or the HP I/O pin where it occurred. SEL due to alpha particles or thermal neurtrons was not observed in SYSMON blocks (VCCAUX) or HP I/O auxiliary blocks (VCCAUX_IO).

The residual SEL rate for a ZU9EG device is approximately 0.25 FIT at 85°C junction temperature (Tj), and 0.65 FIT at 125°C Tj at New York City sea-level. The device-level SEL rate scales based on the previously mentioned resource count in each device, and based on Tj along with the relative neutron flux per the following guidance:

  • Device SEL rate [FIT] = SYSMON SEL rate + HP I/O auxiliary block SEL rate
  • SYSMON SEL rate [FIT] = 0.050 × Number of SYSMONs × Avg flux scaling × Avg Tj scaling
  • HP I/O auxiliary SEL rate [FIT] = 0.0008 × Number of HP I/O auxiliary blocks × Avg flux scaling × Avg Tj scaling

AMD provides an SEU FIT rate calculator tool to calculate the relative flux scale factor. For more information or to download the calculator, go to https://www.xilinx.com/member/avionics.

Table 1. Average Tj Scaling Factor
Tj 20 30 40 50 60 70 80 90 100 110 120 125
Scaling 0.31 0.38 0.46 0.58 0.69 0.85 1.00 1.23 1.50 1.81 2.19 2.42
Table 2. Maximum HP I/O Auxiliary Blocks per Device
Device Ruggedized Packages Maximum HP I/O Auxiliary Blocks per Device 1
XQKU5P SFRB784 and FFRB676 208
XQKU15P FFRA1156 and FFRE1517 572
XQVU3P FFRC1517 520
XQVU7P FLRA2104 and FLRB2104 1040
XQVU11P FLRC2104 624
XQZU3EG SFRA484 and SFRC784 156
XQZU5EV SFRC784 and FFRB900 208
XQZU7EV FFRB900 and FFRC1156 416
XQZU9EG FFRC900 and FFRB1156 208
XQZU11EG FFRC1156 and FFRC1760 416
XQZU15EG FFRC900 and FFRB1156 208
XQZU19EG FFRB1517 and FFRC1760 572
XQZU21DR FFRD1156 416
XQZU28DR FFRE1156 and FFRG1517 416
XQZU29DR FFRF1760 416
XQZU48DR FFRE1156 and FFRG1517 416
XQZU49DR FSRF1760 416
XQZU65DR FFRE1156 260
XQZU67DR FFRE1156 260
  1. Maximum number of HP I/O auxiliary blocks includes bonded and unbonded HP I/O pins.