VSVA1365 Flip-Chip, Fine-Pitch BGA ( XCVU23P )

UltraScale+ Device Packaging and Pinouts Product Specification User Guide (UG575)

Document ID
UG575
Release Date
2023-05-10
Revision
1.19 English

IMPORTANT: This package includes land-side capacitors (LSC), a region of the BGA matrix where the BGA balls are replaced with capacitors. The LSC ball grid size for this package is 5 x 5 in terms of the number of BGA balls replaced by capacitors. Therefore, this package has fewer balls than the package name implies (i.e., the package has 5 x 5 = 25 fewer balls than the implied 1365 balls).

Figure 4-21: Package Dimensions for VSVA1365 ( XCVU23P )

X-Ref Target - Figure 4-21

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