• Uniform stencil aperture can be implemented for the package size of up to 60 mm x 60 mm, and/or the package coplanarity of ≤8 mils, and/or the substrate warpage at peak reflow temperature is ≤100 μm or less for 1 mm pitch and 0.92 mm pitch packages. Under these conditions, the uniform stencil aperture opening of 19.7 mils to 20.0 mils round is recommended, matching the PCB pad size and the stencil thickness is 5 mil.
• For InFO packages with 0.5 mm ball pitch, a uniform stencil with squared aperture openings (rounded corners) of 12 mils and pitch of 19.8 mils, as show in This Figure is recommended. A stencil thickness of 4 mils is also recommended.
