Underfill Keep-out Requirements

UltraScale+ Device Packaging and Pinouts Product Specification User Guide (UG575)

Document ID
UG575
Release Date
2023-05-10
Revision
1.19 English

To ensure that underfill bleed-out does not impact surrounding components, the keep-out requirements shown in the following table must be considered.

Table 9-4: Underfill Keep-out Requirements

Keep-Out Between Components

Minimum Spacing (mm)

Underfilled BGA to underfilled BGA

5.0

Underfilled BGA to non-underfilled BGA

2.5

Underfilled BGA to passive components

2.5