Summary

UltraScale+ Device Packaging and Pinouts Product Specification User Guide (UG575)

Document ID
UG575
Release Date
2023-05-10
Revision
1.19 English

The edge bonding technique uses high-adhesion adhesives dispensed along the periphery of a component, as shown in This Figure . AMD recommends edge bonding for increased mechanical reliability in cases where the device is exposed to extensive temperature cycling or extreme shock and vibration, such as space, defense, and telecommunications applications. Designers are expected to evaluate the need for edge bonding based on the requirements of the specific application implementation.

Figure 9-1: Edge Bonded BGA Packages

X-Ref Target - Figure 9-1

edgebonded-bga-packages.png