Step 4 (Stage 1): Pre-Heating

During pre-heating, allow the component to reach 200°C. Use non-abrasive tools (a wooden probe) to scrape off the underfill fillet around the component. If using a steel probe with a round pointed tip, ensure that the tip is directed away from the component side wall to prevent any damage to the solder mask.

Figure 9-7: Removing Underfill Using Steel Probe

X-Ref Target - Figure 9-7

Figure 9-8: Removing the Underfill Fillet (Before and After)

X-Ref Target - Figure 9-8