This Figure shows typical conditions for solder reflow processing of Sn/Pb soldering using IR/convection. Both IR and convection furnaces are used for BGA assembly. The moisture sensitivity of PSMCs must be verified prior to surface-mount flow.
Notes for This Figure :
1. Maximum temperature range = 225°C (body). Minimum temperature range = 205°C (leads/balls).
2. Preheat dwell 95–180°C for 120–180 seconds.
3. IR reflow must be performed on dry packages.