Silicon and Decoupling Capacitors Height Consideration

When designing heat sink attachments for bare-die flip-chip BGA packages, the height of the die above the substrate and also the height of decoupling capacitors must be considered ( This Figure ). This is to prevent electrical shorting between the heat sink (metal) and the decoupling capacitors.

Figure 12-1: Cross Section of Bare-die Flip-chip BGA

X-Ref Target - Figure 12-1