1. UltraScale Architecture and Product Overview ( DS890 )
2. XQ UltraScale Architecture Data Sheet Overview ( DS895 )
3. UltraScale Device Data Sheets
° Kintex UltraScale FPGAs Data Sheet: DC and AC Switching Characteristics ( DS892 )
° Virtex UltraScale FPGAs Data Sheet: DC and AC Switching Characteristics ( DS893 )
° Artix UltraScale+ FPGAs Data Sheet: DC and AC Switching Characteristics ( DS931 )
° Kintex UltraScale+ FPGAs Data Sheet: DC and AC Switching Characteristics ( DS922 )
° Virtex UltraScale+ FPGAs Data Sheet: DC and AC Switching Characteristics ( DS923 )
4. Zynq UltraScale+ MPSoC Packaging and Pinouts User Guide ( UG1075 )
5. UltraScale Architecture SelectIO Resources User Guide ( UG571 )
6. UltraScale Architecture Clocking Resources User Guide ( UG572 )
7. UltraScale Architecture Configuration User Guide ( UG570 )
8. UltraScale Architecture GTH Transceivers User Guide ( UG576 )
9. UltraScale Architecture GTY Transceivers User Guide ( UG578 )
10. UltraScale Architecture System Monitor User Guide ( UG580 )
11. UltraScale Architecture PCB and Pin Planning User Guide ( UG583 )
12. FAQ: Top Marking Change for 7 Series, UltraScale, and UltraScale+ Products ( XTP424 )
13. UltraScale Architecture FPGAs Memory IP Product Guide ( PG150 )
14. UltraScale Devices Gen3 Integrated Block for PCI Express Product Guide ( PG156 )
15. UltraScale+ Devices Integrated Block for PCI Express Product Guide ( PG213 )
16. Integrated Interlaken 150G Product Guide ( PG169 )
17. UltraScale Devices Integrated Block for 100G Ethernet Product Guide ( PG165 )
18. UltraScale+ Devices Integrated 100G Ethernet Subsystem Product Guide ( PG203 )
19. Mechanical and Thermal Design Guidelines for Lidless Flip-Chip Packages Application Note ( XAPP1301 )
20. MDDS files: Click on this link to find the UltraScale and UltraScale+ FPGA Packaging Specifications . In step 2 select the product category: FPGAs and 3D ICs. In step 3, select the product type. In step 4, click on the package specifications selection to find the available MDDS files.
21. The following websites contain additional information on heat management and contact information.
° Wakefield: www.wakefield-vette.com
° Aavid: www.aavid.com
° Advanced Thermal Solutions: www.qats.com
° Radian Thermal Products: www.radianheatsinks.com
° Thermo Cool: www.thermocoolcorp.com
° CTS: www.ctscorp.com
22. Refer to the following websites for interface material sources:
° Henkel: www.henkel.com
° Bergquist Company: www.bergquistcompany.com
° AOS Thermal Compound: www.aosco.com
° Chomerics: www.chomerics.com
° Kester: www.kester.com
23. Refer to the following websites for CFD tools AMD supports with thermal models.
° Mentor Flotherm: www.mentor.com/products/mechanical/flotherm/flotherm/
° ANSYS Icepak: www.ansys.com
24. Refer to the thermal device models .
25. The following papers are referenced for more information on thermal modelling.
° Lemczyk, T.F., Mack, B., Culham, J.R. and Yovanovich, M.M., 1992, “Printed Circuit Board Trace Thermal Analysis and Effective Conductivity”, ASME J. Electronic Packaging, Vol. 114, pp. 413 - 419.50.
° Refai-Ahmed, G. and Karimanal, K., 2003, “Validation of Compact Conduction Models of BGA Under Realistic Boundary,” J. of Components and Packaging Technology, Vol. 26, No. 3, pp. 610-615.
° Sansoucy, E, Refai-Ahmed, G., and Karimanal, K., 2002, “Thermal Characterization of TBGA Package for an integration in Board Level Analysis,” Eighth Intersociety on Thermal Conference Phenomena in Electronic Systems, San Diego., USA.
° Karimanal,K and Refai-Ahmed, G., and., 2002, “Validation of Compact Conduction Models of BGA Under Realistic Boundary Conditions,” Eighth Intersociety on Thermal Conference Phenomena in Electronic Systems, San Diego, USA.
° Karminal, K. and Refai-Ahmed, G., 2001, “Compact conduction Model (CCM) of Microelectronic Packages- A BGA Validation Study,” APACK Conference on Advance in Packaging, Singapore.