Introduction

UltraScale+ Device Packaging and Pinouts Product Specification User Guide (UG575)

Document ID
UG575
Release Date
2023-05-10
Revision
1.19 English

This chapter discusses the challenges of thermal management including reducing device thermal resistance and optimal power dissipation without an increase in junction temperature. The lidless UltraScale+ FPGA packages target the largest devices while allowing for cooler operation temperatures (up to 10°C) with the same power dissipation.

Precise mechanical design and component thermal management is vital for device and system performance. This document presents the unique thermal and mechanical design requirements for lidless devices.