Heat Sink Removal

UltraScale+ Device Packaging and Pinouts Product Specification User Guide (UG575)

Document ID
UG575
Release Date
2023-05-10
Revision
1.19 English

When removing or reworking heat sinks, the phase-change material residue must be removed from the surface of the die. Laird Technologies, Inc. provides the following guidance for complete removal of the phase-change material from the component.